Protecting Critical Assets: The Application of Soft Epoxy Resins in Mitigating Impact Damage for Electronics and Precision Instruments

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Product Description

Basic Specifications

Model NO.:JOME 3112S
Color:Black, White, Red, Transparent, Yellowish
Material:Epoxy
Classification:Room Curing
Morphology:Solvent, Liquid State
CAS No.:25068-38-6
HS Code:35069900
Origin:China

Packaging & Delivery

Package Size:25.00cm * 25.00cm * 25.00cm
Gross Weight:7.000kg
Specification:Part A: 20kg/drum; Part B: 0.8kg/bottle

Product Description

Epoxy sealant is a high-strength, superior electrical performance, and high surface gloss adhesive formed by mixing epoxy resin and curing agent. This sealing adhesive can cure at room temperature and has characteristics such as high transparency, high adhesion, waterproofing, high temperature resistance, and corrosion resistance.

Widely used in electronic and electrical equipment, it has strong structural support and mechanical protection capabilities after curing. Due to its relatively low price, it is widely used in the automotive industry, consumer electronics components, wind power equipment, aerospace and other fields to enhance the mechanical structural stability and performance stability of these components in harsh environments.

Epoxy Resin Application

Technical Properties

Properties Test Standard PART A PART B
Before Mixing
Appearance \ Black Liquid Brown liquid
Viscosity (cps, 25ºC) GB/10247-2008 95,000±25,000 1,500±500
Density (g/cm³, 25ºC) GB/T 13354-92 1.65±0.05 1.05±0.05
After Mixing
Mix Ratio (by weight) \ A : B = 5 : 1
Potting time (100g, 25ºC) GB/T13477.5-2002 35±10 min
Cured condition GB/T13477.5-2002 24h(25ºC) / 30min(80ºC)
After Cured (Tested after 7 days)
Hardness (Shore D) GB/T 531.1-2008 80
Thermal Conductivity (W/K.T) GB/T 10297-1998 0.40
Dielectric strength (kV/mm) GB/T 1693-2007 >18

Application Selection Guide

ITEM NO APPLICATION CHARACTERISTICS
3102 General Purpose General electronic components and PCB closure. Bright surface, no cracking, moisture insulation.
3105 Thermal Type High-power electronic components requiring heat dissipation. Excellent heat dissipation after curing.
3108 Transparent Type Transparent potting requirements for lighting and modules. High transparency after room temperature curing.
3115 Heat-Resistant Heat-resistant components, full curing at 80ºC. Can be used at temperatures up to 180ºC.
3112 Flame Retardant Capacitor enclosures and solid state relays. Excellent flame retardant properties.
Electronic Potting Process
Product Samples

Frequently Asked Questions

Are you a manufacturer or a trading company?
We are a factory focused on the development and application of polymer materials and high-end electronic adhesives.
Do you provide OEM/ODM services?
Yes, we offer professional OEM label services and market protection for our partners.
How can I obtain samples for testing?
Please contact us directly to request samples for your specific application needs.
What is the typical delivery lead time?
Normally, the delivery time for sample orders is 3 to 7 days, while standard production orders take 7 to 20 days.
How do I proceed with a formal order?
First, share your requirements. Second, we provide a quote. Third, after confirmation and deposit, we begin production. Balance is paid before shipment.
What shipping methods are available?
We offer Express (DHL, UPS, Fedex, TNT), Air shipping, and Sea shipping through nominated or cooperated forwarders.

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